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There’s a certain kind of expertise that can’t be taught in a classroom or learned from a manual. It comes from decades of hands-on work at the intersection oftechnology and strategy, from being the person in the room who has to make the call, defend the investment, and then live with the results. 

That’s the kind of expe...


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This deep dive explores how the semiconductor industry transitioned from the golden age of Moore’s Law and Dennard Scaling to today’s complex 3D FinFET technology. The discussion reveals how traditional flat transistor scaling hit fundamental physical limits, forcing engineers to build vertical ‘fin’ structures that wrap gates around channels in three dimens...


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Background

The SEMI North America Information & Control Committee Spring meetings took place in conjunction with the Advanced Semiconductor Manufacturing Conference (ASMC), a leading international technical conference focused on solutions that improve semiconductor manufacturing expertise. The event was held at the Hilton in Albany, New York.

As usual, the first tw...


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The earlier posts in this series moved step by step through the problem of stress-related Local Layout Effects in advanced FinFET techno...


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The previous post focused on the strongest layout-sensitive mechanisms observed on silicon: Diffusion Breaks and


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